The grain size distribution investigation of high purity plating Cu wire in depth direction

Ke, Yiqing and Namekawa, T and Konkova, Tatyana and Onuki, J. (2012) The grain size distribution investigation of high purity plating Cu wire in depth direction. In: International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), 2012-10-08 - 2012-10-12.

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• Item metadata

  Item type:	Conference or Workshop Item(Paper)
  ID code:	68270
  Dates:	Date Event 2012 Published
  Subjects:	Technology > Engineering (General). Civil engineering (General) > Engineering design
  Department:	Faculty of Engineering > Design, Manufacture and Engineering Management
  Depositing user:	Pure Administrator
  Date deposited:	06 Jun 2019 11:28
  Last modified:	11 Apr 2024 03:09
  URI:	https://strathprints.strath.ac.uk/id/eprint/68270