The grain size distribution investigation of high purity plating Cu wire in depth direction
Ke, Yiqing and Namekawa, T and Konkova, Tatyana and Onuki, J. (2012) The grain size distribution investigation of high purity plating Cu wire in depth direction. In: International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), 2012-10-08 - 2012-10-12.
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ORCID iDs
Ke, Yiqing, Namekawa, T, Konkova, Tatyana ORCID: https://orcid.org/0000-0001-7495-7495 and Onuki, J.;-
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Item type: Conference or Workshop Item(Paper) ID code: 68270 Dates: DateEvent2012PublishedSubjects: Technology > Engineering (General). Civil engineering (General) > Engineering design Department: Faculty of Engineering > Design, Manufacture and Engineering Management Depositing user: Pure Administrator Date deposited: 06 Jun 2019 11:28 Last modified: 11 Nov 2024 16:58 URI: https://strathprints.strath.ac.uk/id/eprint/68270
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