The grain size distribution investigation of high purity plating Cu wire in depth direction

Ke, Yiqing and Namekawa, T and Konkova, Tatyana and Onuki, J. (2012) The grain size distribution investigation of high purity plating Cu wire in depth direction. In: International Conference on Ultrafine Grained and Nanostructured Materials (UFGNSM 2012), 2012-10-08 - 2012-10-12.

Preview

Text. Filename: Ke_etal_UFGNSM2012_grain_size_distribution_investigation.pdf Accepted Author Manuscript Download (318kB)| Preview

Abstract

[Abstract unavailable]

ORCID iDs

Konkova, Tatyana ORCID: https://orcid.org/0000-0001-7495-7495

• Share and Export
  

  ASCII CitationEP3 XMLRIS (EndNote Online, Zotero, Ref manager, etc)HTML CitationOpenURL ContextObject in SpanRIOXX2 XMLRDF+N-TriplesBibTeXMPEG-21 DIDLMODSRefWorksRDF+N3Multiline CSVJSONDublin CoreData Cite XMLSimple MetadataEndNoteAtomMETSOpenURL ContextObjectRDF+XMLRefer
• Item metadata

  Item type:	Conference or Workshop Item(Paper)
  ID code:	68270
  Dates:	Date Event 2012 Published
  Subjects:	Technology > Engineering (General). Civil engineering (General) > Engineering design
  Department:	Faculty of Engineering > Design, Manufacture and Engineering Management
  Depositing user:	Pure Administrator
  Date deposited:	06 Jun 2019 11:28
  Last modified:	12 Dec 2024 16:29
  URI:	https://strathprints.strath.ac.uk/id/eprint/68270