Development of a novel 16-cell densely packed 500×CPV assembly on insulated metal substrate

Micheli, Leonardo and Sarmah, Nabin and Luo, Xichun and Reddy, K.S. and Mallick, Tapas K. (2014) Development of a novel 16-cell densely packed 500×CPV assembly on insulated metal substrate. Energy Procedia, 54. pp. 185-198. ISSN 1876-6102 (https://doi.org/10.1016/j.egypro.2014.07.262)

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Abstract

A novel densely packed receiver for concentrating photovoltaics has been designed to fit a 125× primary and a 4× secondary reflective optics. It can allocate 16 1cm2-sized high concentrating solar cells and is expected to work at about 300 Wp, with a short-circuit current of 6.6 A and an open circuit voltage of 50.72 V. In the light of a preliminary thermal simulation, an aluminum-based insulated metal substrate has been use as baseplate. The original outline of the conductive copper layer has been developed to minimize the Joule losses, by reducing the number of interconnections between the cells in series. Slightly oversized Schottky diodes have been applied for bypassing purposes and the whole design fits the IPC-2221 requirements. A full- scale thermal simulation has been implemented to prove the reliability of an insulated metal substrate in CPV application, even if compared to the widely-used direct bonded copper board. The Joule heating phenomenon has been analytically calculated first, to understand the effect on the electrical power output, and then simulate, to predict the consequences on the thermal management of the board. The outcomes of the present research will be used to optimize the design of a novel actively cooled 144-cell receiver for high concentrating photovoltaic applications.

ORCID iDs

Micheli, Leonardo, Sarmah, Nabin, Luo, Xichun ORCID logoORCID: https://orcid.org/0000-0002-5024-7058, Reddy, K.S. and Mallick, Tapas K.;
CORE (COnnecting REpositories)