Annealing effect on the structure characteristics of nano-scale damascene copper lines

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Konkova, T. and Mironov, S. and Ke, Y. and Onuki, J.; (2013) Annealing effect on the structure characteristics of nano-scale damascene copper lines. In: 2013 IEEE International Interconnect Technology Conference, IITC 2013. IEEE, JPN. ISBN 9781479904389 (https://doi.org/10.1109/IITC.2013.6615574)

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Abstract

High-resolution electron backscatter diffraction (EBSD) technique was applied for systematic and detailed study of grain structure and texture changes in various microstructural regions of nano-scale damascene copper lines after annealing in a wide temperature range of 200-500°C. To ensure reliability of the obtained results, large EBSD maps including several thousand grains were obtained in each case. Above 200°C, the grain structure was established to be surprisingly stable in both the overburden layer as well as within the lines. The grain growth in the lines was supposed to be suppressed by pinning effect of second-phase particles entrapped during electrodeposition process.

ORCID iDs

Konkova, T. ORCID logoORCID: https://orcid.org/0000-0001-7495-7495, Mironov, S., Ke, Y. and Onuki, J.;
  • Item type:Book Section
    ID code:57057
    Dates:
    Date
    Event
    13 June 2013
    Published
    Notes:© 2013 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Design, Manufacture and Engineering Management
    Depositing user: Pure Administrator
    Date deposited:22 Jul 2016 13:52
    Last modified:25 Nov 2024 01:26
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/57057
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