Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature

Hong, C. M. and Gleskova, Helena and Wagner, S. (1997) Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. In: Flat panel display materials III. MRS Symposium Proceedings, 471 . Materials Research Society, Warrendale, PA, pp. 35-40. ISBN 9781558993754

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Abstract

This chapter looks at direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature