Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature

Hong, C. M. and Gleskova, Helena and Wagner, S.; Parsons, G. N. and Fulks, R. T. and Slobodin, D. E. and Yuzuriha, T. H., eds. (1997) Direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature. In: Flat panel display materials III. MRS Symposium Proceedings, 471 . Materials Research Society, USA, pp. 35-40. ISBN 9781558993754

Abstract

This chapter looks at direct writing and lift-off patterning of copper lines at 200ºC maximum process temperature

ORCID iDs

Gleskova, Helena ORCID: https://orcid.org/0000-0001-7195-9639

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• Item metadata

  Item type:	Book Section
  ID code:	33434
  Dates:	Date Event 10 September 1997 Published
  Subjects:	Technology > Electrical engineering. Electronics Nuclear engineering
  Department:	Faculty of Engineering > Electronic and Electrical Engineering
  Depositing user:	Pure Administrator
  Date deposited:	04 Nov 2011 15:54
  Last modified:	11 Nov 2024 14:44
  URI:	https://strathprints.strath.ac.uk/id/eprint/33434