Density measurement of thin-films for micro-electromechanical systems using micro-cantilever structures

Boyd, E.J. and Nock, V. and Li, X. and Uttamchandani, D. (2011) Density measurement of thin-films for micro-electromechanical systems using micro-cantilever structures. Thin Solid Films, 519 (22). pp. 7932-7935. ISSN 0040-6090 (https://doi.org/10.1016/j.tsf.2011.07.017)

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Abstract

The use of micro-cantilever test structures for determining the density of thin film materials is reported. A range of micro-cantilever test structures has been fabricated using silicon, silicon nitride and silicon carbide which are materials that are commonly used in the fabrication of micro-electromechanical systems. The density of each material was determined by combining load–deflection and resonant frequency measurements, and using the Euler–Bernoulli equation for single clamped beams. The density values obtained were 2.35, 3.16 and 3.18 g/cm3 for silicon, silicon carbide and silicon nitride respectively. These values of density for these thin films agree very well with the values quoted in the literature.

ORCID iDs

Boyd, E.J., Nock, V., Li, X. and Uttamchandani, D. ORCID logoORCID: https://orcid.org/0000-0002-2362-4874;
  • Item type:Article
    ID code:33354
    Dates:
    Date
    Event
    1 September 2011
    Published
    18 July 2011
    Published Online
    Keywords:density, silicon-on-insulator, silicon nitride , silicon carbide, micro-electromechanical systems, micro-cantilevers, Electrical Engineering. Electronics Nuclear Engineering, Materials Chemistry, Surfaces and Interfaces, Electronic, Optical and Magnetic Materials, Surfaces, Coatings and Films, Metals and Alloys
    Subjects:Technology > Electrical engineering. Electronics Nuclear engineering
    Department:Faculty of Engineering > Electronic and Electrical Engineering
    Depositing user: Pure Administrator
    Date deposited:16 Sep 2011 10:55
    Last modified:02 Dec 2022 01:29
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/33354
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