Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits
Gleskova, Helena and Cheng, I. Chun and Wagner, Sigurd and Suo, Zhigang (2006) Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits. Applied Physics Letters, 88 (1). 011905. ISSN 0003-6951 (https://doi.org/10.1063/1.2161391)
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A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.
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Item type: Article ID code: 12704 Dates: DateEvent10 April 2006Published3 January 2006Published OnlineSubjects: Technology > Electrical engineering. Electronics Nuclear engineering Department: Faculty of Engineering > Electronic and Electrical Engineering Depositing user: Strathprints Administrator Date deposited: 01 Dec 2011 15:30 Last modified: 08 Apr 2024 16:57 Related URLs: URI: https://strathprints.strath.ac.uk/id/eprint/12704