Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Tools

Gleskova, Helena and Cheng, I. Chun and Wagner, Sigurd and Suo, Zhigang (2006) Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits. Applied Physics Letters, 88 (1). 011905. ISSN 0003-6951 (https://doi.org/10.1063/1.2161391)

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Abstract

A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

ORCID iDs

Gleskova, Helena ORCID logoORCID: https://orcid.org/0000-0001-7195-9639, Cheng, I. Chun, Wagner, Sigurd and Suo, Zhigang;
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