Gleskova, Helena and Ma, E.Y. and Wagner, S. and Shen, D. (1996) Flexible glass substrates with via holes for TFT backplanes. In: Digest of technical papers. AMLCD '96, Kobe, Japan, November 27-29, 1996 . The Japan Society of Physics, Kobe, Japan, pp. 105-108.
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Abstract
This paper looks at flexible glass substrates with via holes for TFT backplanes
| Item type: | Book Section |
|---|---|
| ID code: | 33498 |
| Keywords: | flexible glass substrates, via holes, tft backplanes, Electrical engineering. Electronics Nuclear engineering |
| Subjects: | Technology > Electrical engineering. Electronics Nuclear engineering |
| Department: | Faculty of Engineering > Electronic and Electrical Engineering |
| Related URLs: | |
| Depositing user: | Pure Administrator |
| Date Deposited: | 10 Nov 2011 16:45 |
| Last modified: | 06 Oct 2012 09:29 |
| URI: | http://strathprints.strath.ac.uk/id/eprint/33498 |
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