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Flexible glass substrates with via holes for TFT backplanes

Gleskova, Helena and Ma, E.Y. and Wagner, S. and Shen, D. (1996) Flexible glass substrates with via holes for TFT backplanes. In: Digest of technical papers. AMLCD '96, Kobe, Japan, November 27-29, 1996 . The Japan Society of Physics, Kobe, Japan, pp. 105-108.

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Abstract

This paper looks at flexible glass substrates with via holes for TFT backplanes

Item type: Book Section
ID code: 33498
Keywords: flexible glass substrates, via holes, tft backplanes, Electrical engineering. Electronics Nuclear engineering
Subjects: Technology > Electrical engineering. Electronics Nuclear engineering
Department: Faculty of Engineering > Electronic and Electrical Engineering
Depositing user: Pure Administrator
Date Deposited: 10 Nov 2011 16:45
Last modified: 15 Apr 2015 11:31
URI: http://strathprints.strath.ac.uk/id/eprint/33498

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