Strathprints Home | Open Access | Browse | Search | User area | Copyright | Help | Library Home | SUPrimo

Flexible glass substrates with via holes for TFT backplanes

Gleskova, Helena and Ma, E.Y. and Wagner, S. and Shen, D. (1996) Flexible glass substrates with via holes for TFT backplanes. [Proceedings Paper]

[img]
Preview
PDF - Published Version
Available under License ["licenses_description_unspecified" not defined].

Download (479Kb) | Preview

    Abstract

    This paper looks at flexible glass substrates with via holes for TFT backplanes

    Item type: Proceedings Paper
    ID code: 33498
    Keywords: flexible glass substrates, via holes, tft backplanes, Electrical engineering. Electronics Nuclear engineering
    Subjects: Technology > Electrical engineering. Electronics Nuclear engineering
    Department: Faculty of Engineering > Electronic and Electrical Engineering
    Related URLs:
      Depositing user: Pure Administrator
      Date Deposited: 10 Nov 2011 16:45
      Last modified: 19 Jul 2013 08:58
      URI: http://strathprints.strath.ac.uk/id/eprint/33498

      Actions (login required)

      View Item

      Fulltext Downloads: