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Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Armstrong, G.S. and Pethrick, R.A. and Banks, W.M. and Crane, R.L. (2002) Monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics. In: Adhesive joints. VSP International Science Publishers. ISBN 9789067643719

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Abstract

This chapter looks at monitoring the solvent uptake in adhesive bonded joints using a novel non-destructive technique by applying high frequency dielectrics

Item type: Book Section
ID code: 10170
Notes: print: 9067643718
Keywords: monitoring, solvent uptake, adhesive bonded joints, novel non-destructive technique , high frequency dielectrics, Chemistry
Subjects: Science > Chemistry
Department: Faculty of Science > Pure and Applied Chemistry
Faculty of Engineering > Mechanical and Aerospace Engineering
Depositing user: Strathprints Administrator
Date Deposited: 18 Jan 2012 12:47
Last modified: 21 May 2015 18:49
URI: http://strathprints.strath.ac.uk/id/eprint/10170

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