Deep silicon cell fabrication for chip-scale atomic sensors

McGilligan, James P. and Dyer, Sean and Griffin, Paul F. and Arnold, Aidan S. and Riis, Erling; Scheuer, Jacob and Shahriar, Selim M., eds. (2023) Deep silicon cell fabrication for chip-scale atomic sensors. In: Quantum Sensing, Imaging, and Precision Metrology. Proceedings of SPIE - The International Society for Optical Engineering . SPIE, USA. ISBN 9781510659995 (https://doi.org/10.1117/12.2657383)

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Abstract

Using a simple and cost-effective water-jet process, we have overcome silicon etch depth limitations to realize a 6 mm deep atomic vapor cell. We have successfully used this approach to demonstrate a two-chamber geometry by including a 25 mm meandering channel between the alkali pill chamber and main interrogation chamber. Additionally, we have recently used this approach in the fabrication of deep cut silicon cells for cold atom systems. The results will be highlighted, as well as providing an overview of our advancements on mass producible components for cold-atom systems and the amalgamation of this technology towards a fully integrated system.

ORCID iDs

McGilligan, James P. ORCID logoORCID: https://orcid.org/0000-0002-6514-9696, Dyer, Sean ORCID logoORCID: https://orcid.org/0000-0001-9419-4915, Griffin, Paul F. ORCID logoORCID: https://orcid.org/0000-0002-0134-7554, Arnold, Aidan S. ORCID logoORCID: https://orcid.org/0000-0001-7084-6958 and Riis, Erling ORCID logoORCID: https://orcid.org/0000-0002-3225-5302; Scheuer, Jacob and Shahriar, Selim M.