Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method
Konkova, Tatyana and Ke, Yiqing and Mironov, Sergey and Onuki, Jin (2012) Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. In: Advanced Metallization Conference 2012: 22nd Asian Session, 2012-10-22 - 2012-10-25, The University of Tokyo.
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Abstract
The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.
ORCID iDs
Konkova, Tatyana
Item type: Conference or Workshop Item(Paper) ID code: 68274 Dates: DateEvent2012PublishedKeywords: nanomaterials, grain boundaries, EBSD, Engineering design, Engineering(all) Subjects: Technology > Engineering (General). Civil engineering (General) > Engineering design Department: Faculty of Engineering > Design, Manufacture and Engineering Management Depositing user: Pure Administrator Date deposited: 06 Jun 2019 11:50 Last modified: 23 Feb 2021 10:09 Related URLs: URI: https://strathprints.strath.ac.uk/id/eprint/68274
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