Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method

Konkova, Tatyana and Ke, Yiqing and Mironov, Sergey and Onuki, Jin (2012) Analysis of electrodeposited nano-scale copper wire microstructure by EBSD method. In: Advanced Metallization Conference 2012: 22nd Asian Session, 2012-10-22 - 2012-10-25, The University of Tokyo.

[img]
Preview
 Text (Konkova-etal-ADMETA2012-analysis-of-electrodeposited-nano-scale-copper-wire-microstructure-EBSD-method)
Konkova_etal_ADMETA2012_analysis_of_electrodeposited_nano_scale_copper_wire_microstructure_EBSD_method.pdf
Accepted Author Manuscript
Download (637kB)| Preview

    Abstract

    The high-resolution electron backscatter diffraction (EBSD) technique was applied to study electrodeposited and subsequently annealed nano-scale copper wires. The mean grain size was found to be coarser than the mean free path of electrons (~ 40 nm). The wires were shown to contain a notable fraction of low-angle boundaries as well as annealing twins. The material was found have a strong {111}<110> texture.

    Creators(s): Konkova, Tatyana ORCID logoORCID: https://orcid.org/0000-0001-7495-7495, Ke, Yiqing, Mironov, Sergey and Onuki, Jin;
    Item type:Conference or Workshop Item(Paper)
    ID code:68274
    Keywords:nanomaterials, grain boundaries, EBSD, Engineering design, Engineering(all)
    Subjects:Technology > Engineering (General). Civil engineering (General) > Engineering design
    Department:Faculty of Engineering > Design, Manufacture and Engineering Management
    Depositing user: Pure Administrator
    Date deposited:06 Jun 2019 11:50
    Last modified:27 May 2020 00:16
    Related URLs:
    URI:https://strathprints.strath.ac.uk/id/eprint/68274
    Export data:
    CORE (COnnecting REpositories)