Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study

Boinard, P. and Banks, W.M. and Pethrick, R.A. (2002) Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study. Journal of Adhesion, 78 (12). pp. 1015-1026. ISSN 0021-8464 (http://dx.doi.org/10.1080/00218460215042)

Abstract

A study of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Fröhlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.

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  Item type:	Article
  ID code:	5760
  Dates:	Date Event 2002 Published
  Keywords:	adhesively bonded composite structure, dielectric spectroscopy, Kirkwood-Frohlich equation, dipolar activity, dynamic mechanical thermal analysis, pure and applied chemistry, mechanical engineering, Mechanical engineering and machinery, Chemistry, Materials Chemistry, Surfaces, Coatings and Films, Mechanics of Materials, Chemistry(all), Surfaces and Interfaces
  Subjects:	Technology > Mechanical engineering and machinery Science > Chemistry
  Department:	Faculty of Engineering > Mechanical and Aerospace Engineering Faculty of Science > Pure and Applied Chemistry
  Depositing user:	Strathprints Administrator
  Date deposited:	15 Apr 2008
  Last modified:	19 May 2023 01:08
  URI:	https://strathprints.strath.ac.uk/id/eprint/5760