Impact of laser scribing for efficient device separation of LED components

Illy, E.K. and Knowles, M.R.H. and Gu, E. and Dawson, M.D. (2005) Impact of laser scribing for efficient device separation of LED components. Applied Surface Science, 249 (1-4). pp. 354-361. ISSN 0169-4332

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Abstract

Laser scribing of light emitting diode (LED) components on sapphire substrates is shown in this paper to be a viable method of device separation. Three key measurements revealing the effects of UV laser scribing on the LED component performance are discussed and compared for laser scribing at 255 and 355 nm. The differences in these two UV wavelengths are further discussed in terms of quality; comparing pulse energies and pulse repetition frequencies for UV ablation of sapphire. In general, these results prove laser processing can be used as an effective high volume manufacturing procedure for substrate separation.

Author(s):Illy, E.K., Knowles, M.R.H., Gu, E. and Dawson, M.D.
Item type:Article
ID code:5266
Keywords:laser scribing, sapphire scribing, laser dicing, UV wavelengths, LEDs, photonics, Optics. Light, Surfaces, Coatings and Films
Subjects:Science > Physics > Optics. Light
Department:Faculty of Science > Physics > Institute of Photonics
Depositing user: Strathprints Administrator
Date deposited:31 Jan 2008
Last modified:03 Jan 2019 11:39
URI:https://strathprints.strath.ac.uk/id/eprint/5266
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