Integrated self-assembling and holding technique applied to a 3-D MEMS variable optical attenuator
Li, L. and Zawadzka, Justyna and Uttamchandani, D.G. (2004) Integrated self-assembling and holding technique applied to a 3-D MEMS variable optical attenuator. Journal of Microelectromechanical Systems, 13 (1). pp. 83-90. ISSN 1057-7157
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The application of polysilicon/gold bimorph stress-induced curved beams for three-dimensional self-assembly of MEMS devices is reported. The mechanical principle behind this self-assembling procedure is presented and comparison with current assembling methods are made. With this self-assembling technique, no postprocessing is required. A free-space optical MEMS device in the form of a variable optical attenuator (VOA) has been fabricated and self-assembled using this technique. The angular elevation of the self-assembled structures and the attenuation characteristics of the optical MEMS device are reported. The VOA has a measured dynamic attenuation range of 44 dB at 1.55 /spl mu/m optical wavelength. The bending of the bimorph beams is also temperature controllable, and the thermal behavior of the beams is also reported.
Creators(s): |
Li, L., Zawadzka, Justyna and Uttamchandani, D.G. ![]() | Item type: | Article |
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ID code: | 3512 |
Keywords: | micro-optics, optical attenuators, optical fabrication, thermal expansion, Electrical engineering. Electronics Nuclear engineering, Mechanical Engineering, Electrical and Electronic Engineering |
Subjects: | Technology > Electrical engineering. Electronics Nuclear engineering |
Department: | Faculty of Engineering > Electronic and Electrical Engineering Faculty of Science > Physics |
Depositing user: | Strathprints Administrator |
Date deposited: | 18 Jun 2007 |
Last modified: | 01 Jan 2021 08:08 |
URI: | https://strathprints.strath.ac.uk/id/eprint/3512 |
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