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Efficient flip-chip InGaN micro-pixellated light-emitting diode arrays: promising candidates for micro-displays and colour conversion

Gong, Z. and Gu, E. and Jin, S.R. and Massoubre, D. and Guilhabert, B.J.E. and Zhang, H.X. and Dawson, M.D. and Poher, V. and Kennedy, G.T. and French, P.M.W. and Neil, M.A.A. (2008) Efficient flip-chip InGaN micro-pixellated light-emitting diode arrays: promising candidates for micro-displays and colour conversion. Journal of Physics D: Applied Physics, 41 (094002). ISSN 0022-3727

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Flip-chip InGaN micro-pixellated LED arrays with high pixel density and improved device performance are presented. The devices, with 64 × 64 elements, each of which have a 20 µm emission aperture on a 50 µm pitch, are fabricated with a matrix-addressable scheme at blue (470 nm) and UV (370 nm) wavelengths, respectively. These devices are then flip-chip bonded onto silicon mounts. Good emission uniformity across the LED array is demonstrated, which can be attributed to the introduced n-metal tracks adjacent to each n-GaN mesa and the p-contact lines running across parallel columns. More importantly, with a flip-chip configuration, the optical power output and the current-handling capability of these new devices are substantially enhanced, due to the improved heat dissipation capability and the increased light extraction efficiency. For instance, each pixel in the flip-chip blue (respectively UV) LED arrays can provide a maximum power density 43 W cm−2 (respectively 6.5 W cm−2) at an extremely high current density up to 4000 A cm−2 before breakdown. These flip-chip devices are then combined with a computer-programmable driver circuit interface to produce high-quality micro-scale displays. Other promising applications of these LEDs, such as colour conversion with quantum dots, are also demonstrated.