Farlow, R. and Galbraith, W. and Knowles, M. and Hayward, G. (2001) Micromachining of a piezocomposite transducer using a copper vapour laser. IEEE Transactions on Ultrasonics, Ferroelectrics and Frequency Control, 48 (3). pp. 639-640. ISSN 0885-3010Full text not available in this repository. (Request a copy from the Strathclyde author)
A 1-3 piezocomposite transducer with front face dimensions of 2×2 mm has been micromachined using a copper vapor laser. The device consists of PZT5A piezoceramic pillars with a 65-μm pitch suspended in a low viscosity thermosetting polymer. The kerf width is 13 μm, and the transducer thickness is 170 μm, making the device suitable for ultrasonic reception at frequencies close to 10 MHz.
|Keywords:||laser beam machining, lead compounds, micromachining, piezoceramics, ultrasonic transducers, Electrical engineering. Electronics Nuclear engineering, Instrumentation, Acoustics and Ultrasonics, Electrical and Electronic Engineering|
|Subjects:||Technology > Electrical engineering. Electronics Nuclear engineering|
|Department:||Faculty of Engineering > Electronic and Electrical Engineering|
|Depositing user:||Strathprints Administrator|
|Date Deposited:||04 Nov 2008|
|Last modified:||29 Apr 2016 07:59|