Boinard, P. and Banks, W.M. and Pethrick, R.A. (2002) Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study. Journal of Adhesion, 78 (12). pp. 1015-1026. ISSN 0021-8464
Full text not available in this repository. (Request a copy from the Strathclyde author)Abstract
A study of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Fröhlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.
| Item type: | Article |
|---|---|
| ID code: | 5760 |
| Keywords: | adhesively bonded composite structure, dielectric spectroscopy, Kirkwood-Frohlich equation, dipolar activity, dynamic mechanical thermal analysis, pure and applied chemistry, mechanical engineering, Mechanical engineering and machinery, Chemistry |
| Subjects: | Technology > Mechanical engineering and machinery Science > Chemistry |
| Department: | Faculty of Engineering > Mechanical and Aerospace Engineering Faculty of Science > Pure and Applied Chemistry |
| Related URLs: | |
| Depositing user: | Strathprints Administrator |
| Date Deposited: | 15 Apr 2008 |
| Last modified: | 12 Mar 2012 10:43 |
| URI: | http://strathprints.strath.ac.uk/id/eprint/5760 |
Actions (login required)
| View Item |