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Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study

Boinard, P. and Banks, W.M. and Pethrick, R.A. (2002) Use of dielectric spectroscopy to assess adhesively bonded composite structures, Part II: Dielectric study. Journal of Adhesion, 78 (12). pp. 1015-1026. ISSN 0021-8464

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Abstract

A study of the sorption and desorption of moisture in a structural adhesively bonded composite structure using low- and high-frequency dielectric spectroscopy is reported when the adhesive is subjected to a hot and wet environment. As water penetrates the structure, variations in the dielectric permittivity and dielectric loss can be used to understand the nature of the absorption process. A new dielectric tool is introduced to aid interpretation of the dielectric data based on the Kirkwood-Fröhlich equation of the dipolar activity. The data are correlated with gravimetric and dynamic mechanical thermal analysis of the adhesive during exposure to moisture reported in Part I of this series of three articles.

Item type: Article
ID code: 5760
Keywords: adhesively bonded composite structure, dielectric spectroscopy, Kirkwood-Frohlich equation, dipolar activity, dynamic mechanical thermal analysis, pure and applied chemistry, mechanical engineering, Mechanical engineering and machinery, Chemistry
Subjects: Technology > Mechanical engineering and machinery
Science > Chemistry
Department: Faculty of Engineering > Mechanical and Aerospace Engineering
Faculty of Science > Pure and Applied Chemistry
Related URLs:
    Depositing user: Strathprints Administrator
    Date Deposited: 15 Apr 2008
    Last modified: 12 Mar 2012 10:43
    URI: http://strathprints.strath.ac.uk/id/eprint/5760

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