Suo, Z. and Ma, E. Y. and Gleskova, H. and Wagner, S. (1999) Mechanics of rollable and foldable film-on-foil electronics. Applied Physics Letters, 74 (8). pp. 1177-1179. ISSN 0003-6951Full text not available in this repository. (Request a copy from the Strathclyde author)
The mechanics of film-on-foil devices is presented in the context of thin-film transistors on steel and plastic foils. Provided the substrates are thin, such transistors function well after the foils are rolled to small radii of curvature. When a substrate with a lower elastic modulus is used, smaller radii of curvature can be achieved. Furthermore, when the transistors are placed in the neutral surface by sandwiching between a substrate and an encapsulation layer, even smaller radii of curvature can be attained. Transistor failure clearly shows when externally forced and thermally induced strains add to, or subtract from, each other.
|Keywords:||integrated circuit manufacture , thermal stresses , internal stresses, Electrical engineering. Electronics Nuclear engineering, Physics and Astronomy (miscellaneous)|
|Subjects:||Technology > Electrical engineering. Electronics Nuclear engineering|
|Department:||Faculty of Engineering > Electronic and Electrical Engineering|
|Depositing user:||Pure Administrator|
|Date Deposited:||12 Oct 2011 10:19|
|Last modified:||24 Jun 2016 02:30|