Forbes, C (2005) Display assembly having flexible transistors on a flexible substrate : patent application. 7H 05K A.Full text not available in this repository. (Request a copy from the Strathclyde author)
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
|Keywords:||thin films, polymide substrate, conductive properties, Electrical engineering. Electronics Nuclear engineering|
|Subjects:||Technology > Electrical engineering. Electronics Nuclear engineering|
|Department:||Faculty of Engineering > Electronic and Electrical Engineering|
|Depositing user:||Pure Administrator|
|Date Deposited:||30 Sep 2011 08:23|
|Last modified:||02 Feb 2017 01:30|