Forbes, C (2005) Display assembly having flexible transistors on a flexible substrate : patent application. 7H 05K A.
Full text not available in this repository. (Request a copy from the Strathclyde author)Abstract
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
| Item type: | Patent |
|---|---|
| ID code: | 33396 |
| Keywords: | thin films, polymide substrate, conductive properties, Electrical engineering. Electronics Nuclear engineering |
| Subjects: | Technology > Electrical engineering. Electronics Nuclear engineering |
| Department: | Faculty of Engineering > Electronic and Electrical Engineering |
| Related URLs: | |
| Depositing user: | Pure Administrator |
| Date Deposited: | 30 Sep 2011 09:23 |
| Last modified: | 04 Oct 2012 18:01 |
| URI: | http://strathprints.strath.ac.uk/id/eprint/33396 |
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