Forbes, C (2005) A method for pattern metallization of substrates. H01L021/00.Full text not available in this repository. (Request a copy from the Strathclyde author)
The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.
|Keywords:||adhesion layer , substrate, electrically conductive properties, electrophotographic imaging compound, pattern metallization, lamination properties, electronic circuit , flexible polymeric substrates, rigid polymeric substrates, Electrical engineering. Electronics Nuclear engineering, Electrical and Electronic Engineering|
|Subjects:||Technology > Electrical engineering. Electronics Nuclear engineering|
|Department:||Faculty of Engineering > Electronic and Electrical Engineering|
|Depositing user:||Strathprints Administrator|
|Date Deposited:||28 Sep 2011 14:04|
|Last modified:||04 May 2016 09:38|