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A method for pattern metallization of substrates

Forbes, C (2005) A method for pattern metallization of substrates. H01L021/00.

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Abstract

The present invention provides a method for forming an adhesion layer in contact with a first surface of a substrate and a surface of a layer having electrically conductive properties using electrophotographic imaging compound as a mask. The adhesion layer improves the lamination properties of the electrically conductive layer to the substrate. The improved lamination properties to facilitate and increase the reliability and quality of a resulting product having an electronic circuit formed in accordance with the present invention. The method disclosed herein is well suited for use with rigid polymeric substrates and flexible polymeric substrates.

Item type: Patent
ID code: 12780
Keywords: substrates, insulator layer, flexible substrate, Electrical engineering. Electronics Nuclear engineering
Subjects: Technology > Electrical engineering. Electronics Nuclear engineering
Department: Faculty of Engineering > Electronic and Electrical Engineering
Related URLs:
Depositing user: Strathprints Administrator
Date Deposited: 28 Sep 2011 15:04
Last modified: 06 Sep 2014 23:00
URI: http://strathprints.strath.ac.uk/id/eprint/12780

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