Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits

Gleskova, Helena and Cheng, I. Chun and Wagner, Sigurd and Suo, Zhigang (2006) Thermomechanical criteria for overlay alignment in flexible thin-film electronic circuits. Applied Physics Letters, 88 (1). 011905. ISSN 0003-6951 (https://doi.org/10.1063/1.2161391)

Abstract

A simple mechanical model for a deposited film / substrate couple is presented to describe how film deposition at elevated temperature induces change in the substrate’s in-plane dimensions at room temperature. The model provides a quantitative guideline for reducing, or completely eliminating, this elongation, by tailoring the tensile built-in stress in the deposited film. The dimensional stability so achieved is necessary for accurate overlay alignment of photomasks during the fabrication of thin-film electronic circuits.

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• Item metadata

  Item type:	Article
  ID code:	12704
  Dates:	Date Event 10 April 2006 Published 3 January 2006 Published Online
  Subjects:	Technology > Electrical engineering. Electronics Nuclear engineering
  Department:	Faculty of Engineering > Electronic and Electrical Engineering
  Depositing user:	Strathprints Administrator
  Date deposited:	01 Dec 2011 15:30
  Last modified:	08 Apr 2024 16:57
  Related URLs:	Scopus publication
  URI:	https://strathprints.strath.ac.uk/id/eprint/12704